Development of texture and morphology in Cu-Ag thin nanocomposite films on Si
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چکیده
منابع مشابه
In Situ Ordering of FePt Thin Films by Using Ag / Si and Ag / Mn 3 Si / Ag / Si Templates
In situ ordering of FePt thin films by sputtering onto Ag/Si and Ag/Mn3Si/Ag/Si templates has been demonstrated. Due to the evolution from island-like to a continuous film structure as a function of Ag thickness, the ordering and orientation of the FePt films both change with Ag thickness. A continuous (002) Ag film results in a greater L10 phase formation with -axis oriented both perpendicular...
متن کاملTENSILE TESTING OF FREE-STANDING Cu, Ag AND Al THIN FILMS AND Ag/Cu MULTILAYERS
ÐFree standing polycrystalline thin ®lms with a strong h111i texture were tested in uniaxial tension. Studied were electron-beam deposited Ag, Cu and Al ®lms, and Ag/Cu multilayers consisting of alternating Ag and Cu layers of equal thickness, between 1.5 nm and 1.5 mm (bilayer repeat length, l, between 3 nm and 3 mm). The ®lms had a total thickness of about 3 mm. A thin polymeric two-dimension...
متن کاملInterface structure and surface morphology of (Co, Fe, Ni)/Cu/Si(100) thin films
We have examined bilayer Co/Cu, Fe/Cu, and Ni/Cu films deposited by molecular-beam epitaxy on hydrogen-terminated @100# silicon substrates. The magnetic metal/copper interface was examined by atomic resolution transmission electron microscopy and compared with the surface morphology as depicted by atomic force microscopy. The general orientation relationships across the magnetic metal/copper in...
متن کاملTEXTURE of Cu and DILUTE BINARY Cu(Ti) and Cu(In) THIN FILMS
The development of texture in thin Cu and dilute binary Cu(Ti) and Cu(In) films has been investigated as a function of annealing history. The textures are comprised of <111>, <100> and <110> fiber in different proportions for the three films. Annealing strengthens the texture for all films. For the annealed films, alloying with Ti strengthens the <111> component, whereas alloying with In weaken...
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ژورنال
عنوان ژورنال: Journal of Physics: Conference Series
سال: 2008
ISSN: 1742-6588,1742-6596
DOI: 10.1088/1742-6596/100/8/082008